Description
Tecbond 134 very fast setting adhesive designed for packaging application, carton sealing, tray erecting and point of sale. A combination of fast set time and medium viscosity allows Tecbond 134 to be used on a wide range of paper, card, plain and printed board materials.
Can be used as a low melt adhesive for heat sensitive materials, e.g. polystyrene and foam applied via a suitable Tec glue gun at a temperature range between 130c-160c
All constituent parts of this adhesive have been approved by the American F.D.A under C.F.R 21.175.105 (adhesives).
For use with all Tec 43mm glue guns.
- Best joint designs for hot melt gluing
- What is a cold bond ?
- Are glue sticks waterproof ?
- What is a Hot Melt Adhesive?
- What makes a Tecbond hot melt glue sticks… stick?
- Hot Melt fumes
Important: Hot Melt Adhesives do have limitations! Being a thermoplastic product hot melt adhesives soften with heat and return to a solid state by the loss of heat. With this in mind, standard hot melt adhesives are not recommend for applications subjected to heat or direct sunlight. However we do offer grades with high heat resistance. Water and hot melt adhesives are a bad combination – standard hot melt adhesives are not waterproof and should be avoided for external applications. On saying this, we do have PUR adhesives that can be use externally and can even be dry cleaned. We strongly recommend that you thoroughly test the product and satisfy yourselves that the product is suitable for your application. This product suggested uses are a generalised suggestion and other factors may play a role in achieving the required bond, e.g. heat resistance, chemical resistance, gap filling, surface area to glue, open time or a degree of glue flexibility may be required etc.
Please contact our technical team on 0161 627 1001 to discuss your application in further detail.
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